Air Cavity Plastic (ACP) Packages
Our air cavity and near hermetic packages offer exceptional reliability and performance, ensuring the longevity of your electronic components in demanding environments.
Better, faster, overall lower cost.
ACP RF Power packages enable the use of copper bases in an air cavity configuration, providing best-in-class watts per dollar, higher RF performance and a lower cost over traditional ceramic solutions.
RQFN packages provide enhanced thermal and higher electrical performance over standard air cavity ceramic QFN’s at competitive price points.
Standard and custom package offerings.
We provide standard packages that enables faster time to market at an overall lower cost with proven reliability. We also offer the option to custom tool packages to meet your specifications.
The total package solution.
We bring together RJR’s epoxy formulated adhesives, specialty packaging materials and a custom package assembly process for a world-class solution.
Air cavity packages are required for a variety of sensors as well as radio frequency (RF) applications. These requirements can include features such as lid transparency, high voltage and extreme temperature tolerance, as well as a "near-hermetic" seal.
The RF Power ACP packages can be configured for use as a 2-piece or 3-piece package. The products offered by RJR are: headers, sidewalls and lids. This provides maximum flexibility in the selection of the thermal flange, which can be purchased from RJR or a 3rd party of your choice.
ACP RF Power Headers
ACP RF Power Standard Sidewalls
ACP RF Power Standard Lids
ACP Package Materials
RQFN Bases
The RQFN packages are offered as a 2-piece solution which consists of a lid and a base.
RQFN Lids
RQFN Package Materials
Choose RJR Technologies for innovative packages, best seal in the industry b-stage components, and advanced sealing equipment that meet the highest industry standards.
Our products are backed by our extensive expertise, commitment to quality, and dedication to delivering exceptional solutions for your electronic packaging needs.
Contact us today to explore how our products can enhance the performance, reliability, and cost-effectiveness of your electronic components.