This publication highlights our comprehensive offerings, including packages, B-stage epoxies, and sealing systems, and provides an...

RJR Technologies introduces a cost-effective, near-hermetic packaging solution for photonics. Built on proven RF power package design, the 14-pin butterfly package delivers exceptional reliability, passing rigorous JEDEC and MIL-STD tests while offering scalability, flexibility, and reduced production costs for PIC applications.

RJR Technologies attended Laser World of Photonics 2025 in Munich, showcasing its latest packaging solutions including 14-pin butterfly and 40-pin PIC packages. Sven Knippscheer and Marco Koelink connected with key prospects exploring LCP and B-stage epoxy technologies for LiDAR, 3D sensing, and more. With strong interest and market alignment, RJR is considering exhibiting in 2026.

RJR Technologies is attending Laser World of Photonics 2025 in Munich, June 24–27. Join Marco Koelink and Sven Knippscheer as they showcase RJR’s advanced packaging solutions for the photonics and microelectronics industries. This leading global event highlights innovations in lasers, optics, sensors, and more. Reach out to connect or stop by to say hello!