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The photonics industry is increasing looking for scalable and high-volume air-cavity packaging solutions with good quality and near-hermetic performance.


With our expertise and experience in semiconductor packages, we can offer Butterfly, VCSEL, ROSA, TROSA and other layouts that meet the highest industry standards.

Photonics Documentation


The  Photonics ACP packages can be configured for use as a 2-piece or 3-piece package. The products offered by RJR are: headers, sidewalls and lids. This provides maximum flexibility in the selection of the thermal flange, which can be purchased from RJR or a 3rd party of your choice.


To better understand RJR’s package progression from RF Power to Photonics, please review the white paper “A Low-Cost, Near-Hermetic Air-Cavity Package for Photonics Integrated Circuits (PICs).


RJR is developing various open tooled products to address the Photonics market. If you wish to discuss a custom package, please contact customer service.

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Technologies Solutions

Choose RJR Technologies for innovative packages, best seal in the industry b-stage components, and advanced sealing equipment that meet the highest industry standards.


Our products are backed by our extensive expertise, commitment to quality, and dedication to delivering exceptional solutions for your electronic packaging needs.


Contact us today to explore how our products can enhance the performance, reliability, and cost-effectiveness of your electronic components.

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