Photonics

The photonics industry is increasing looking for scalable and high-volume air-cavity packaging solutions with good quality and near-hermetic performance.

With our expertise and experience in semiconductor packages, we can offer Butterfly, VCSEL, ROSA, TROSA and other layouts that meet the highest industry standards.

Better, faster, overall lower cost.

ACP RF Power packages enable the use of copper bases in an air cavity configuration, providing best-in-class watts per dollar, higher RF performance and a lower cost over traditional ceramic solutions.

RQFN packages provide enhanced thermal and higher electrical performance over standard air cavity ceramic QFN’s at competitive price points.

The Photonics market demands overall lower costs, near hermetic packages offer exceptional reliability and performance, ensuring the longevity of your electronic components in demanding environments.

Standard and custom package offerings.

We provide standard packages that enables faster time to market at an overall lower cost with proven reliability. We also offer the option to custom tool packages to meet your specifications.

The total package solution.

We bring together RJR’s epoxy formulated adhesives, specialty packaging materials and a custom package assembly process for a world-class solution.

Air cavity packages are required for a variety of sensors as well as radio frequencies (RF) and Photonics applications. These requirements can include features such as lid transparency, high voltage and extreme temperature tolerance, as well as a "near-hermetic" seal.

Photonics Documentation

Datasheets

The Photonics ACP packages can be configured for use as a 2-piece or 3-piece package. The products offered by RJR are: headers, sidewalls and lids. This provides maximum flexibility in the selection of the thermal flange, which can be purchased from RJR or a 3rd party of your choice.

Papers

To better understand RJR’s package progression from RF Power to Photonics, please review the white paper “A Low-Cost, Near-Hermetic Air-Cavity Package for Photonics Integrated Circuits (PICs).

Drawings

RJR is developing various open tooled products to address the Photonics market. If you wish to discuss a custom package, please contact customer service.

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Technologies Solutions

Choose RJR Technologies for innovative packages, best seal in the industry b-stage components, and advanced sealing equipment that meet the highest industry standards.

Our products are backed by our extensive expertise, commitment to quality, and dedication to delivering exceptional solutions for your electronic packaging needs.

Contact us today to explore how our products can enhance the performance, reliability, and cost-effectiveness of your electronic components.