RJR Technologies to Attend Semicon Europa 2025 in Munich

This publication highlights our comprehensive offerings, including packages, B-stage epoxies, and sealing systems, and provides an in-depth look at our near-hermetic air cavity technologies and their proven high reliability. We invite you to review the paper and reach out to discuss how RJR can support your product needs. ACP package

RJR Technologies introduces a cost-effective, near-hermetic packaging solution for photonics. Built on proven RF power package design, the 14-pin butterfly package delivers exceptional reliability, passing rigorous JEDEC and MIL-STD tests while offering scalability, flexibility, and reduced production costs for PIC applications.

RJR Technologies attended Laser World of Photonics 2025 in Munich, showcasing its latest packaging solutions including 14-pin butterfly and 40-pin PIC packages. Sven Knippscheer and Marco Koelink connected with key prospects exploring LCP and B-stage epoxy technologies for LiDAR, 3D sensing, and more. With strong interest and market alignment, RJR is considering exhibiting in 2026.

RJR Technologies is attending Laser World of Photonics 2025 in Munich, June 24–27. Join Marco Koelink and Sven Knippscheer as they showcase RJR’s advanced packaging solutions for the photonics and microelectronics industries. This leading global event highlights innovations in lasers, optics, sensors, and more. Reach out to connect or stop by to say hello!

On this International Day of Light, RJR Technologies celebrates advancing photonics with innovative, scalable packaging solutions. Our LCP and ACP technologies support high-performance optical applications and global growth through key partnerships.

RJR attended the 10th annual PIC International Conference in Brussels to spotlight the need for scalable, high-reliability packaging in photonics. We connected with global stakeholders, shared our air-cavity plastic solutions, and reinforced packaging’s role in enabling volume adoption of photonic integrated circuits.

Join us for an online industry event, where Marco Koelink will introduce RJR's Photonics packages. This session will explore Photonic...

RJR Technologies partners with PHIX to launch innovative plastic air-cavity packaging for photonics.

RJR's TROSA package for 200-400Gb datacom offers high reliability, advanced design, and 50% cost savings with cutting-edge materials.

Opsys and RJR partnered to develop the ALTOS LiDAR system, achieving high reliability and cost efficiency with advanced packaging solutions.

Packaging challenges for photonic integrated circuits (PICs) hinder breakthroughs; cost-effective solutions are vital for progress.