RJR Technologies to Attend Semicon Europa 2025 in Munich

This publication highlights our comprehensive offerings, including packages, B-stage epoxies, and sealing systems, and provides an in-depth look at our near-hermetic air cavity technologies and their proven high reliability. We invite you to review the paper and reach out to discuss how RJR can support your product needs. ACP package

RJR Technologies introduces a cost-effective, near-hermetic packaging solution for photonics. Built on proven RF power package design, the 14-pin butterfly package delivers exceptional reliability, passing rigorous JEDEC and MIL-STD tests while offering scalability, flexibility, and reduced production costs for PIC applications.

RJR Technologies attended Laser World of Photonics 2025 in Munich, showcasing its latest packaging solutions including 14-pin butterfly and 40-pin PIC packages. Sven Knippscheer and Marco Koelink connected with key prospects exploring LCP and B-stage epoxy technologies for LiDAR, 3D sensing, and more. With strong interest and market alignment, RJR is considering exhibiting in 2026.