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RJR will be attending Advanced Packaging International 2026
RJR Technologies will be represented at AP International in Brussels by Sven Knippscheer, who will be on-site engaging with partners, customers, and industry peers across the semiconductor ecosystem.
Mar 24


New Air-Cavity Package Architectures using Dual Epoxy Advanced Packaging (DEAP©)
RJR Technologies has developed a dual-epoxy approach based on two complementary B-stage epoxy systems - one conductive and one non-conductive - integrated within a unified assembly and sealing process. This Dual Epoxy Advanced Packaging (DEAP©) concept enables the formation of electrical interconnects and robust, near-hermetic seals within air-cavity plastic packages, while maintaining compatibility with established manufacturing workflows.
Mar 12


RJR Technologies to Attend Semicon Europa 2025 in Munich
We’re pleased to announce that RJR Technologies will be attending SEMICON Europa 2025 in Munich, Germany. As one of Europe’s most influential events for the semiconductor supply chain, SEMICON Europa brings together leaders in materials, equipment, IC packaging, heterogeneous integration, power electronics, and advanced manufacturing. The exhibition is a key platform for discovering the technologies shaping the future of microelectronics.
Nov 17, 2025


RJR Technologies is pleased to announce the release of our new white paper, “RJR Near Hermetic Packages.”
This publication highlights our comprehensive offerings, including packages, B-stage epoxies, and sealing systems, and provides an in-depth look at our near-hermetic air cavity technologies and their proven high reliability. We invite you to review the paper and reach out to discuss how RJR can support your product needs. ACP package
Sep 24, 2025


Discover How LCP Air-Cavity Packages Deliver Near-Hermetic Reliability for Photonics
RJR Technologies introduces a cost-effective, near-hermetic packaging solution for photonics. Built on proven RF power package design, the 14-pin butterfly package delivers exceptional reliability, passing rigorous JEDEC and MIL-STD tests while offering scalability, flexibility, and reduced production costs for PIC applications.
Aug 13, 2025


RJR Technologies at Laser World of Photonics
RJR Technologies attended Laser World of Photonics 2025 in Munich, showcasing its latest packaging solutions including 14-pin butterfly and 40-pin PIC packages. Sven Knippscheer and Marco Koelink connected with key prospects exploring LCP and B-stage epoxy technologies for LiDAR, 3D sensing, and more. With strong interest and market alignment, RJR is considering exhibiting in 2026.
Jul 8, 2025
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