New Air-Cavity Package Architectures using Dual Epoxy Advanced Packaging (DEAP©)

RJR Technologies has developed a dual-epoxy approach based on two complementary B-stage epoxy systems - one conductive and one non-conductive - integrated within a unified assembly and sealing process. This Dual Epoxy Advanced Packaging (DEAP©) concept enables the formation of electrical interconnects and robust, near-hermetic seals within air-cavity plastic packages, while maintaining compatibility with established manufacturing workflows.

Discover this advanced solution and characteristics of our B-stage epoxies in our recent white paper.

White paper - New Air-Cavity Package Architectures - DEAP.pdf

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