Exploring the Future of Power Electronics, Sensors, and Advanced Packaging at PCIM Europe & SENSOR+TEST 2026

RJR Technologies participated in PCIM Europe and SENSOR+TEST in Nuremberg on June 10–11, 2026, engaging with customers, partners, and industry experts across the semiconductor, sensor, photonics, and power electronics sectors.

Both exhibitions once again proved to be valuable platforms for discussing current technology trends and future requirements in advanced semiconductor packaging. Throughout the event, the RJR team held a series of productive meetings with existing customers, development partners, and potential new customers from Europe, North America, and Asia.

A key topic across many discussions was the growing demand for packaging solutions that combine high reliability, thermal performance, scalability, and cost-effective manufacturing. Particular interest was shown in RJR’s near-hermetic air-cavity packaging technologies, pre-applied B-stage epoxy solutions, and packaging concepts for RF, sensor, and photonic applications.

The exhibitions also provided valuable insights into emerging market trends and next-generation device architectures. Discussions with customers and partners highlighted opportunities for new package configurations, advanced assembly approaches, and future product developments that may further expand RJR’s technology portfolio.

RJR Technologies supports advanced semiconductor packaging requirements with a broad portfolio including:

• Pre-applied B-stage epoxy solutions

• LCP, ceramic, metal, and glass package components with pre-applied B-stage epoxy

• Air-cavity near-hermetic plastic packages

• RF and high-power device packaging solutions

• Photonic and optical device packaging

• Isothermal Sealing Technology (ITS) systems and process solutions

We would like to thank all customers, partners, and industry colleagues who took the time to meet with us during the exhibitions. The discussions were highly valuable and will contribute to ongoing customer projects, technology developments, and future collaborations.

We look forward to continuing these conversations and supporting the next generation of semiconductor packaging solutions.