RJR will be attending Advanced Packaging International 2026

Advanced Packaging International is the number one global event covering compound semiconductor, photonic integrated circuits, power electonics and packaging technologies. With a strong over-lap between the conferences, attendees and exhibitors are exposed to the full relevant supply chains and customer and supplier bases.

RJR Technologies will be represented at AP International in Brussels by Sven Knippscheer, who will be on-site engaging with partners, customers, and industry peers across the semiconductor ecosystem.

Sven will be available to discuss how RJR’s near-hermetic plastic packaging solutions and advanced B-stage epoxy technologies support high-reliability applications in RF power, sensors, photonics, and next-generation semiconductor devices.

If you are attending, Sven would be pleased to connect - whether for a brief exchange during the event or a more in-depth discussion around your packaging challenges and development roadmap.

Feel free to reach out in advance to schedule a meeting. We look forward to connecting with the community in Brussels.