RJR Technologies participated in PCIM Europe and SENSOR+TEST in Nuremberg on June 10–11, 2026, engaging with customers, partners, and industry experts across the semiconductor, sensor, photonics, and power electronics sectors. Both exhibitions once again proved to be valuable platforms for discussing current technology trends and future requirements in advanced semiconductor packaging. Throughout the event, the RJR team held a series of productive meetings with existing customers,...

RJR Technologies will be represented at AP International in Brussels by Sven Knippscheer, who will be on-site engaging with partners, customers, and industry peers across the semiconductor ecosystem.

RJR Technologies has developed a dual-epoxy approach based on two complementary B-stage epoxy systems - one conductive and one non-conductive - integrated within a unified assembly and sealing process. This Dual Epoxy Advanced Packaging (DEAP©) concept enables the formation of electrical interconnects and robust, near-hermetic seals within air-cavity plastic packages, while maintaining compatibility with established manufacturing workflows.