RJR's TROSA package for 200-400Gb datacom offers high reliability, advanced design, and 50% cost savings with cutting-edge materials.

Opsys and RJR partnered to develop the ALTOS LiDAR system, achieving high reliability and cost efficiency with advanced packaging solutions.

Packaging challenges for photonic integrated circuits (PICs) hinder breakthroughs; cost-effective solutions are vital for progress.