Our air cavity and near hermetic packages offer exceptional reliability and performance, ensuring the longevity of your electronic components in demanding environments. 

With our expertise in material sciences and semiconductor packaging, our products exceed industry standards.  

Our range of B-stage pre-applied epoxies offers exceptional adhesive properties, ensuring a nearly hermetic seal between two components in various applications, such as ceramic or plastic lids for air cavity packages, glass lids for optical sensors and metal components for medical applications.

​

We also specialize in custom formulations to address challenging scenarios involving difficult or dissimilar materials providing tailored solutions to meet your specific requirements.

As part of our commitment to supporting our customers success, we offer pre-programmed sealing equipment designed to improve yields and ensure consistent and reliable sealing of components. 

By streamlining the sealing process, our equipment helps enhance productivity, reduces costs, and increases overall efficiency.

The photonics industry is increasing looking for scalable and high-volume air-cavity packaging solutions with good quality and near-hermetic performance.

With our expertise and experience in semiconductor packages, we can offer Butterfly, VCSEL, ROSA, TROSA and other layouts that meet the highest industry standards.