Celebrating the International Day of Light: RJR Technologies Illuminates the Future of Photonic Packaging

On this International Day of Light, we at RJR Technologies proudly highlight our contributions to the photonics industry through innovative packaging solutions that drive the advancement of optical technolgies.

Pioneering Photonic Packaging Solutions

The photonics industry demands packaging solutions that are not only cost-effective but also deliver high performance and reliability. RJR Technologies addresses these needs with our advanced Air Cavity Plastic (ACP) packages, which offer near-hermetic sealing and exceptional thermal management. These packages are ideal for applications such as Butterfly modules, VCSELs, ROSAs, and TROSAs, ensuring the longevity and efficiency of photonic devices in demanding environments.

Advanced Materials and Processes

Our proprietary epoxies and injection-molded Liquid Crystal Polymer (LCP) packages provides superior performance and design flexibility at a lower cost compared to traditional kover, ceramic, and over-molded plastic packaging solutions. This technology enables scalable, high-volume manufacturing, making it suitable for a wide range of photonic applications.

Strategic Partnerships for Global Impact

In collaboration with PHIX, a European packaging foundry specializing in Photonic Integrated Circuits (PICs), we have expanded our reach to the European market. This partnership combines RJR’s expertise in advanced packaging with PHIX’s capabilities in hybrid integration and optical assembly, delivering cutting-edge solutions for the global semiconductor market.

Commitment to Quality and Innovation

With decades of experience, RJR Technologies remains committed to delivering high-quality, innovative packaging solutions. Our comprehensive approach encompasses everything from proprietary epoxies, package designs, and sealing processes ensuring that we meet the evolving needs of the photonics industry.

As we celebrate the International Day of Light, RJR Technologies reaffirms its dedication to illuminating the path forward in photonic packaging. Our continued innovation and strategic collaborations position us at the forefront of enabling the next generation of optical technologies.