Can epoxy-sealed photonics packages approach hermetic fine-leak performance?

(Picture courtesy of Brilliance B.V.)

A new paper from Brilliance and RJR presents encouraging results from a photonics package sealed with RJR’s B-stage epoxy technology. Even after thermal shock and humidity stress, the package retained very low helium leak rates.

The findings challenge the common assumption that epoxy sealing cannot approach fine-leak performance and highlight its potential for flexible, scalable near-hermetic photonics packaging.

➤ Read the paper for the full test methodology and results.