RJR at ECOC26 – RJR and PHIX Photonics Assembly test and validate a newly developed LCP-based air-cavity butterfly package
We’re excited to announce our collaboration with PHIX Photonics Assembly on a scalable LCP air-cavity butterfly package for high-volume photonics manufacturing.
The new package is designed as a 1:1 drop-in replacement for PHIX’s established 14-pin gold-box butterfly package. By combining an injection-molded liquid crystal polymer (LCP) housing with a metal leadframe, the concept enables strip-level assembly and efficient batch processing - offering a compelling path toward lower packaging cost and greater scalability.
RJR Technologies brings extensive experience in LCP-based air-cavity packaging, near-hermetic epoxy sealing, and high-volume semiconductor packaging for RF and power electronics applications. Together with PHIX’s expertise in photonic assembly and integration, we are adapting and validating this technology for the specific requirements of the photonics market.
RJR and PHIX are currently conducting testing to further validate package hermeticity and reliability for photonic applications. We look forward to the validation results and to advancing a scalable alternative to traditional metal butterfly packages.
Designing a PIC or #LaserDiode for an LCP air-cavity package? The same design guidelines used for PHIX’s standard 14-pin gold-box butterfly package can serve as the starting point.
➤ Design guidelines: https://www.phix.com/14-pin-butterfly-design-guidelines/
Meet our partner PHIX at the ECOC Exhibition in Málaga, Spain, booth 1051, to learn more about the package and photonic assembly concept.
