
RJR Technologies, a leading developer and high-volume manufacturer of air-cavity near-hermetic plastic semiconductor packages, pre-applied b-stage epoxy components, and sealing equipment, has long supported the RF industry with a comprehensive portfolio of reliable, high-performance packages. These solutions are designed to ensure the durability and efficiency of electronic components in challenging environments.
PHIX, a European packaging foundry, specializes in all major PIC (Photonic Integrated Circuit) technology platforms. It provides assembly services and contract manufacturing for PICs and MEMS. With a recently established state-of-the-art production facility in Enschede, the Netherlands, PHIX has positioned itself as a key player in the European OSAT ecosystem for photonics.
The partnership between RJR and PHIX combines RJR’s expertise in advanced packaging solutions with PHIX’s capabilities in hybrid integration, optical assembly, and RF electrical connectivity. Together, they aim to deliver cutting-edge, high-performance assembly solutions for the global semiconductor market.
Wil Salhuana, CEO of RJR Technologies, stated, "As we introduce advanced photonics packages built on the proven performance of our established RF packages—offering best-in-class performance, rapid time to market, and cost efficiency—PHIX emerged as the ideal OSAT partner to provide comprehensive backend solutions for our customers."
Representatives from RJR and PHIX will showcase these backend solutions at SPIE Photonics West in San Francisco from January 28 to 30, 2025, at booth #5304. A flyer with additional details, available at the event, is linked below.
For further information, please contact:
RJR Technologies
3602 La Salle St.
Phoenix, AZ 85040
USA
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PHIX BV
Hengelosestraat Zuidzijde 5257521 AG EnschedeThe Netherlands
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