Discover How LCP Air-Cavity Packages Deliver Near-Hermetic Reliability for Photonics

This white paper explores RJR Technologies’ innovative 14-pin butterfly package, built on proven RF power packaging technology. Learn how its design, materials, and manufacturing processes achieve exceptional reliability—passing rigorous JEDEC and MIL-STD tests—while offering scalability, cost savings, and flexibility for photonics applications. See why this near-hermetic solution is poised to replace traditional ceramic packages.

Download the full white paper to see detailed test results, design insights, and application benefits.

Abstract. RJR previously presented a low-cost package solution that can replace packages used in photonics.

The technology is based on existing air cavity plastic (ACP) package technology used in RF power applications.

Based on structural similarities between RF packages and a 14-pins butterfly package, we predict in this paper

the reliability of a 14-pin butterfly package against an ACP2-0800-6V RF power package.

First Author, E-mail: mkoelink@rjrtechnologies.com

White Paper reliability LCP air-cavity photonic packages.pdf

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Drawing of SW1230-6C5E package with lid and base.

Drawing of OP2012-14A photonic package with lid and eared base.

Drawing of SW0800-6U8 package with lid and base.